Vinayaka Missions - Aarupadai Veedu Institute of Technology

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Collaborations

The management believes in collaborative projects and hence has established tie-ups with industries and research organizations. The institution has signed Memorandums of Understanding (MoU) with Hewlett Packard, the Central Leather Research Institute (CLRI), Numerical Simulation Tech (NST), Tokyo, Japan, Hindustan Teleprinters Limited (HTL), Nature Soft and many more. Such tie-ups enhance faculty research, technical and professional training, technical consultancy, project quality and technology exchange. AVIT lanches Educational Partnership Programme with Hewlett Packard
In order to create a technology enabled learning environment for the students, Vinayaka Missions University has entered into an MoU with Hewlett Packard (HP).
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AVIT signs MoU with Numerical Simulation Technology, Japan.
AVIT signs MoU with LinuXpert Systems An MoU has been signed with LinuXpert Systems for training on various Linux/ Open-sources Software for the students and the faculty members of Computer Science and Engineering. AVIT signs MoU with HTL Technical Learning Centre An MoU has been signed with HTL Technical Learning Centre for training on GSM/ CDMA Technologies to the students of Bachelor of Electronics and Communication Engineering using the needed software and hardware training with field experts.

AVIT signs MoU with Nature Soft Private Limited An MoU has been signed with Nature soft Private Limited to train the students of Computer Science and Engineering and Information Technology on various Open-sources Software. AVIT signs MoU with the Central Leather Research Institute An MoU has been signed with the Central Leather Research Institute (CLRI), CSIR, to sponsor Joint Research and Development Projects for the benefit of the students and faculty members. AVIT signs MoU with Oracle India Private Limited An MoU has been signed with Oracle India Private Limited to provide training under Oracle Workforce Development Programme to the students of Computer Science and Engineering and Information Technology.